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    • Heat-diffusing FPC

    Features

    kouhonetsu_single

    Lower heat resistance through use of thin PI for base film

    Improved heat diffusion through use of thermally conductive resin for adhesive on metal reinforcement board

    Withstand voltage of at least 3 kV (between boards / metal reinforcement boards)

    Structure example

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    Exoergic feature (thermal resistance) simulation outcome

    koufonetsu_e_03

    Applications

    ● Lighting – LED lamps – LED tube lamps
    ● LCD TV- LED backlights – Module circuit boards
    ● Car lights- With high heat-dissipating Kapton® Polyimide Tape adapted to uneven surfaces

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